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Flex-rigid PCB (Rigid-Flex PCB) design option for PCB layer stackup
Flex-rigid PCB (Rigid-Flex PCB) design option for PCB layer stackup
Click:4935 From: GSPCB Date: 2009-08-22
Flex-rigid PCB (Rigid-Flex PCB) design option for PCB layer stackup
Click:420 From: Gspcb Date: 2009-08-22

Polar Instruments said it added a flex-rigid PCB/Rigid-flex pcb (printed circuit board) design option to its Speedstack PCB layer stackup design system, which the company said allows PCB fabricators and OEM designers to create and accurately document PCB stackups, combining rigid and flex-rigid PCBs, and to reduce manufacturing costs through fast evaluation of a wide range of alternative materials and suppliers.
The Speedflex flex-rigid PCB/rigid-flex pcb design option allows PCB fabrication and OEM designers to create and accurately document PCB stackups.

The company said the Speedflex option provides designers with an ultra fast process that can build flex-rigid Multilayer PCB stacks in minutes, document drills, display the stacks as a two or three-dimensional image, and add controlled impedance, with goal-seeking, to complete the design. Speedstack does not limit the number of layers that can be added, or the number of cross-sections that can be created and compared, including coverlays, adhesives, and no-flow prepreg layers, allowing more flexibility to fine tune the stack design for optimum cost and performance.

The completed stack is documented automatically and can be exported in industry standard file formats, which helps eliminate manual errors and ensures that the PCB specifications are communicated clearly and consistently to every company and individual in the design and fabrication process.

While error-free documentation tightens control over the finished board, Speedflex also provides the flexibility for fabricators to safely reduce manufacturing costs. Libraries of materials, suppliers, costs and lead-times illustrate the impact that changing materials or suppliers will have on the cost, lead-time and electrical specifications of the finished board, which helps reduce the time taken to manually calculate the impact of each slight change to the board and provides more opportunities to find the most cost effective materials and suppliers within the electrical specifications of the finished board.

Source from Goldenshine.

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