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Factory Adress: Fufa Industrial Park, Fuyong Hi-Tech Industrial Zone, Baoan District, Shenzhen, China.

TEL: +86-75586306051
FAX: +86-75586306453
Email: sales@goldenshinepcb.com
           info@goldenshinepcb.com

Technology Roadmap

Technology Roadmap


Technology
2009
2010 to 2012
Finished Hole Size
Mechanical Drill Size
>= 10 mils
= 8 mils
Control Impedence
+/- 10%
+/- 8%
Stack Via (Laser)
Epoxy Filled Vias
Fill Vias by Plating
Materials
Normal FR4 (Tg 135ˇăC to 170ˇăC)
Lead-Free FR4 (Tg 150ˇăC to 170ˇăC)
Halogen-Free FR4 (Tg 150ˇăC to 170ˇăC)
Microvia Type
2 + 2 with Buried Hole (Staggered)
2 + 2 with Buried Hole (Stack-up)
3 + 3 with Buried Hole (Stack-up)
Through/Buried hole Aspect Ratio (Mechanical)
8 : 1
10 : 1
Blind Hole Aspect Ratio(Laser)
0.5 : 1
0.85 : 1
Line/Space
4/4 mils
3/3 mils
Layers
14 Layers
20 Layers

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